Microsanj – Wafer-Level Thermal Characterization with ATV Systems
Together with Microsanj LLC, ATV Systems offers high-resolution thermal imaging at the wafer level for semiconductor testing. Microsanj develops systems for thermoreflectance (TR) imaging, adding thermal analysis to ATV's portfolio of electrical measurement and characterization. As a partner for MPI integration solutions, we integrate Microsanj systems into MPI wafer probe systems, allowing thermal behaviour to be captured directly at the probe tip on the wafer.
Why ATV Systems for Microsanj solutions?
Thermoreflectance imaging is most useful when it is tied to electrical test – when electrical stimulation, heating, measurement and correlation take place on a common platform. This is where we come in: ATV Systems integrates Microsanj imaging into MPI probe systems, combining electrical characterization with thermal analysis into a single, coordinated setup.
As a system integrator with more than 20 years of experience in semiconductor measurement, and as a European partner for MPI integration solutions, we sit at the interface between Microsanj thermal imaging and MPI wafer probe technology. We advise you on selecting the right solution, integrate the components into your probe system, and support you through to the first reliable measurement – as a single point of contact in Dresden.
The Microsanj technology: thermoreflectance
Thermoreflectance exploits the fact that a material's refractive index – and therefore its reflectivity – changes with temperature. Using a lock-in technique, this small change in reflectivity is converted into a spatially resolved temperature map. The method is contact-free and non-invasive, and provides resolution well beyond that of conventional infrared microscopy.
- Spatial resolution: down to 250 nm (sub-micron) – compared with typically >5 µm for IR-only thermography
- Thermal sensitivity: temperature changes down to approximately 10 mK
- Temporal resolution: from 50 ns as standard to the picosecond range (down to 500 ps with the PicoSCOPE upgrade) for transient events
- Material-independent: works equally on metals and semiconductors – without the emissivity limitations of IR thermography
- Dual-mode (IR + TR): wide-field IR mapping to quickly locate hotspots, with the TR mode to zoom in at the highest spatial and temporal resolution
This makes it possible to resolve local hotspots, nanoscale defects and fast transient thermal events that remain hidden to conventional infrared microscopy.
Application Areas
RF, mmWave and GaN devices
RF and power-amplifier devices generate high local power densities in very small areas. Microsanj thermal imaging resolves the thermal conditions of individual fingers and active regions, supporting the characterization and modelling of GaN HEMTs and mmWave devices – complementing RF and load-pull characterization on MPI probe systems.
Typical applications: hotspot analysis of GaN power amplifiers, thermal characterization of mmWave and phased-array devices, validation of thermal models for 5G/6G components
Power electronics (SiC, GaN, IGBT)
For wide-bandgap devices, temperature distribution and thermal management have a decisive influence on efficiency and reliability. Combined with MPI's high-power probe systems, Microsanj thermal imaging enables the spatially resolved thermal evaluation of power semiconductors under realistic electrical conditions.
Typical applications: thermal characterization of SiC and GaN devices, IGBT modules, assessment of current distribution and hotspots, reliability studies
Photonics and optoelectronics
Laser diodes, LEDs and photonic components are sensitive to thermal effects. The high spatial and temporal resolution of thermoreflectance supports the thermal optimization and reliability assessment of optoelectronic devices.
Typical applications: thermal management of laser diodes and LEDs, thermal analysis of optical waveguides, characterization of silicon photonics structures
Failure analysis and reliability
The non-destructive, high-resolution nature of the imaging makes it well suited to failure analysis. Local over-temperatures and transient events can be located precisely – a basis for defect analysis, process assessment and reliability studies.
Typical applications: localization of hotspots and defects, transient failure analysis, process-integrity assessment, reliability and lifetime studies
Our Services
Consulting and solution design
Our application engineers analyse your thermal measurement task and recommend the appropriate Microsanj solution – from the entry-level EZ500 to the higher-performance NT220 – along with the right configuration for your application and your MPI probe system.
Integration into MPI probe systems
The focus of our work is the integration of Microsanj thermal imaging into MPI wafer probe systems. The EZ-THERM controllers and sensors are combined with the MPI iMAG microscope on the probe station; this integration has been demonstrated on automated platforms such as the MPI TS2000 and TS3000 series. The result is a continuous workflow: electrically stimulate, heat, measure thermally, and correlate the results directly at the wafer level.
Installation and Training
Our experts install the system at your facility, perform on-site validation and train your operators – getting your team up and running as quickly as possible.
Installation and training
Our specialists install the integrated system at your site, commission it, and train your users in the combined use of electrical measurement and thermal imaging.
Service and Support
As a local point of contact in Dresden, we support you throughout the system's life cycle. We coordinate service, maintenance and repair work with Microsanj. For integration into your MPI probe system and for application-related questions, we are your direct contact.
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