Chuck Systeme

Wafer probing at different temperatures continues to be a significant challenge. MPI is working together with ERS to provide unified software and hardware integration of thermal chucks in all MPI Engineering Probe Systems. The new Integrated Technology (IT) is responsible for unsurpassed:

• Measurement results,
• Less maintenance
• Best in class thermal characteristics:
  • Fastest transition time
  • Better system flatness
  • Excellent thermal distribution over the entire temperature range.

Together MPI Corporation and ERS electronic GmbH designed the New 300 mm Thermal Chuck AirCool® PRIME Technology family, offering unsurpassed thermal flexibility with reduced soaking time by 60%, and the largest variety of thermal ranges on market.
The systems can be configured with lower temperature starting points of -60°C, -40°C, -10°C, 20°C or 30°C and at the higher end points at 200°C or 300°C – all this in order to tailor the thermal capability to a different requirements and budgets. AirCool® PRIME technology can test at -10°C without a chiller or at -40°C using a very small chiller making the systems extremely cost-effective in order to reduce the overall cost of test.
Reduced transition time, improved electrical performance, easier testing under inert-gas atmosphere, and field upgradability are additional values of the AirCool® PRIME thermal chuck systems.