Power Test Platform 3kV / 800A

This measurement system offers an all-in-one solution for high power characterization.

IV, CV and high-current testing in a single measurement run – output, transfer and capacitance measurements (Ciss/Coss/Crss) without rewiring and without multiple wafer touchdowns. A single DUT contact for the complete characterization.
Wide measurement range for power semiconductors – up to 3 kV and 50 A/100 A as standard, or up to 800 A in the extended configuration with integrated high-current modules.
Drastically reduced test time – eliminating additional wafer passes saves many minutes of stepping time per wafer.
Seamless transition from development to production – the same Measmatic™ tests, the same probing concept and the same software across all automation levels. No test redesign, no software migration – saving months of engineering effort compared to an ATE migration.
Optimized for modern power devices – designed for SiC MOSFETs, GaN HEMTs, IGBTs, power diodes and high-current power modules, at both wafer level and package level.
Precise low-leakage architecture – the ATV HVC switch architecture achieves a leakage current of <50 fA/V and includes integrated oscillation suppression and protection modules for safe high-power measurements.
100% MPI integration and proven measurement technology – full compatibility with MPI probe systems, based on established Keithley and Keysight measurement technology with worldwide calibration support; CE-certified with integrated safety interlocks.

DC voltage range (drain): 1 mV to 3000 V
Maximum drain current: various configurations up to 10 A / 50 A / 100 A / 400 A / 800 A (2000 A on request)
Switch leakage current: < 50 fA/V (low-leakage design)
ate leakage range: 100 pA to 100 µA
CV measurement: fully automated capacitance measurement (Ciss/Coss/Crss) at up to 3,000 V DC bias
Form factor & integration: 19" rack (38 HU / 42 HU) with industrial PC

<h3>From characterization to production</h3>

<p>The ATV Power Test Platform (PTP) bridges the gap between flexible engineering lab setups and scalable but rigid ATE testers. Where traditional setups reach their limits when scaling into production, and an ATE migration typically requires three to six months of engineering effort, the PTP provides a seamless path from device characterization to wafer-level production testing – on a single platform.</p>

<h3>IV, CV and high-current testing in a single run</h3>

<p>The decisive advantage lies in the integrated single-run concept: IV, CV and high-current measurements are performed in one automated run, without rewiring and without multiple wafer touchdowns. A single DUT contact eliminates additional wafer passes and the stepping time they require, pad quality improves thanks to fewer touchdowns per die, and unattended operation becomes possible.</p>

<h3>Scalable up to 3 kV and 800 A</h3>

<p>The platform is designed to be scalable and upgradeable. With voltages up to 3 kV and a selectable drain SMU – from a cost-effective entry level through standard to extended configuration – the PTP adapts to the respective current and budget requirements. The ATV UHC high-current extension adds a second measurement range on top, reaching 400 A and 800 A (higher ranges on request) without having to replace the base configuration.</p>

<h3>Consistent from R&D to the fab</h3>

<p>The greatest economic leverage comes from consistency across all automation levels: the same Measmatic™ tests, the same probing concept and the same software – from R&D to the fab. There is no test redesign, no software migration and no change of probing concept. This eliminates the multi-month reimplementation of an ATE migration and significantly accelerates th

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